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Chen Yu Huang, Chong Leong Gan

Electronic Materials Innovations and Reliability in Advanced Memory Packaging

This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are …

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Liu Chu

Stochastic Finite Element Modeling in Electronic Packaging

An expert integration of digital twin technology and advanced simulation methods for the design and optimization of electronic packaging systemsIn Stochastic Finite Element Modeling in Electronic Packagin…

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