Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
Buch
- Materials, Processes, Equipment, and Reliability
- Herausgeber: Kim S. Siow
- Springer International Publishing AG, 02/2019
- Einband: Gebunden, HC runder Rücken kaschiert
- Sprache: Englisch
- ISBN-13: 9783319992556
- Bestellnummer: 8703266
- Umfang: 304 Seiten
- Nummer der Auflage: 19001
- Auflage: 1st ed. 2019
- Gewicht: 605 g
- Maße: 241 x 161 mm
- Stärke: 25 mm
- Erscheinungstermin: 7.2.2019
Achtung: Artikel ist nicht in deutscher Sprache!
Klappentext
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys.Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials;
Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium;
Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.